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Thermally efficient heat sink compound made with Silicone Fluid with 20% Metal Oxide. For direct use on Transistors, Triacs, Thyristors, ICs, CPUs, GPUs and Heatsinks etc.
Thermal Conductivity: 1.93 W/m-K
Thermal Resistance: < 0.225°C/W
Working Temperature: -30°C ~ 280℃
Dielectric Breakdown: > 5.0 KV ac
Package: Syringe
Net Weight: 30g
HSC30G
£4.50
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NPN TO3 140V 20A 200W Hi Fi. Low Distortion. Complement to MJ15004
GENUINE NEW ON-Semi (Motorola) transistors bought from a franchised distributor
